Flooring Adhesive MS Polymer

Flooring Adhesive  MS Polymer AS-4030 is an environmentally friendly wood flooring adhesive formulated with advanced MS Polymer technology, eliminating common problems associated with traditional polyurethane adhesives. It cures on exposure to atmospheric moisture and quickly forms a tenacious but elastic bond on wood flooring and wall decorative materials. When cured, it is waterproof and is not adversely affected by exposure to moisture or water. Its elastic characteristic allows the wood floor to expand and contract without adhesion failures.

AS-4030 MS Flooring Adhesive contributing to Leadership in Energy and Environmental Design (LEED) v4.1 credit. The EQ Credit: Low-Emitting Materials requires 75 % of adhesives and sealants to meet the volatile organic compound (VOC) emissions evaluation and 100 % of adhesives and sealants to meet the VOC content evaluation. For VOC emissions, the product is to be tested as per the California Department of Public Health (CDPH) Standard Method v1.2-2017. The product must comply with the VOC allowable concentration listed in Table 4-1 of the standard method. The total VOC (TVOC) after 14 days is required to be reported in ranges as specified in the standard method. Formaldehyde content was not detected in all test results.

For VOC content, the product is to be tested as per the South Coast Air Quality Management District (SCAQMD) Rule 1168. The VOC content of AS-4030 MS Flooring Adhesive is 9.49g/L (refer to certificate CCN18040004H03-0). This is below the current (100g/L) under “Wood Flooring Adhesive” category.
Based on the test result of VOC emission (test report 7191274108-CHM22-02-MA-AD2-CR1) and VOC content (certificate CCN18040004H03-0), AS-4030 MS Flooring Adhesive complies with requirements of LEED v4.1 EQ Credit: Low-Emitting Materials.

Flooring Adhesive MS Polymer AS-4030 is easy to apply with a trowel. Its non-slump formula allows the trowel’s serrated ridges to hold firmly. This ensures maximum contact between the glued surfaces, bridging gaps between the wood floor and the subfloor and reducing problems with the floor’s cavity. Because it contains no water or solvents, it does not cause dimensional changes in wood. It is also safe because it contains no hazardous materials, such as isocyanate, and has an ultra-low VOC content.

Ideal for bonding wood floors to concrete, plywood, cured levelling compounds, moisture vapour barrier, OSB (underlayment grade), particleboard, rubber underlay, gypsum board, ceramic tiles, stone, terrazzo, radiant heated subfloors, metal decking, steel, and aluminium.
For other applications, please contact us.